Logitech Precision Lapping and Polishing Equipment |
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Compatible with Sapphire, GaAs, InP, Silcon wafer thinning Capable of thinning three 2" wafers or one single 4" wafer instantaneously
Logitech PM5 Precision Lapping and Polishing Machine
Logitech WSB2 Wafer Substrate Bonding Unit for temporary wax mounting of wafers |
